Commercial · SamtecUpdated 2026-10-03
SEAF-20-05.0-S-04-2-A-K-TR
The base code '20' indicates 20 positions per row, '05.0' refers to a 5.0mm stack height, 'S' denotes 30µ" (0.76µm) Gold plating on the contact area and Matte Tin on the solder tail, '04' signifies 4 rows, '2' indicates Lead-Free Solder Charge, and 'A' specifies a vertical mounting angle. The suffix 'K' indicates a Polyimide Film Pick & Place Pad, and 'TR' specifies Tape & Reel packaging. The SEAF prefix identifies this as a Samtec SEARAY™ High Density, High Speed Open Pin Field Array socket connector.
Part number dissection
SEAFThe SEAF prefix identifies this as a Samtec SEARAY™ High Density, High Speed Open Pin Field Array socket connector.
20-05.0-S-04-2-AThe base code '20' indicates 20 positions per row, '05.0' refers to a 5.0mm stack height, 'S' denotes 30µ" (0.76µm) Gold plating on the contact area and Matte Tin on the solder tail, '04' signifies 4 rows, '2' indicates Lead-Free Solder Charge, and 'A' specifies a vertical mounting angle.
K-TRThe suffix 'K' indicates a Polyimide Film Pick & Place Pad, and 'TR' specifies Tape & Reel packaging.
Specifications
Base codeThe base code '20' indicates 20 positions per row, '05.0' refers to a 5.0mm stack height, 'S' denotes 30µ" (0.76µm) Gold plating on the contact area and Matte Tin on the solder tail, '04' signifies 4 rows, '2' indicates Lead-Free Solder Charge, and 'A' specifies a vertical mounting angle.
Finish / variantThe suffix 'K' indicates a Polyimide Film Pick & Place Pad, and 'TR' specifies Tape & Reel packaging.
Connector TypeHigh Density Array, Female
Number of Positions80
Pitch0.050" (1.27mm)
Number of Rows4
Mounting TypeSurface Mount
FeaturesBoard Guide, Pick and Place
Contact FinishGold
Contact Finish Thickness30.0µin (0.76µm)
Mated Stacking Heights7mm, 8mm, 8.5mm, 11.5mm, 12mm, 14mm, 16mm, 18mm
Height Above Board0.199" (5.05mm)
Acceptable alternates
SEAF-20-05.0-L-04-2-A-K-TRDifferent plating option (10µ" Gold on contact area, Matte Tin on solder tail) while maintaining the same base dimensions.
SEAF-20-05.0-P-04-2-A-K-TRDifferent plating option (SureCoat™ 3µ" Gold Flash and 30µ" Palladium Nickel on contact area, Matte Tin on solder tail) while maintaining the same base dimensions.
SEAF-20-05.0-S-04-1-A-K-TRDifferent solder type (Tin/Lead Alloy Solder Charge) while maintaining the same base dimensions.
SEAF-20-05.0-S-04-2-A-K-FRDifferent packaging option (Full Reel Tape & Reel) while maintaining the same base dimensions.
Confirm acceptability against your drawing before ordering.
Availability
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BTEK Components MFG LLC · Largo, FloridaPart data compiled and verified by BTEK's sourcing engine.