Part number dissection
SEAMSamtec SEARAY™ High Density, High Speed Open Pin Field Array Terminal connector.
30-03.5-L-08-230: Positions Per Row; 03.5: Lead Style; L: Plating Option (10 µ" (0.25 µm) Gold on contact area, Matte Tin on solder tail); 08: Number of Rows; 2: Solder Type (Lead-Free Solder Charge).
A-K-TRA: Alignment Pin; K: Polyimide Film Pick & Place Pad; TR: Tape & Reel packaging.
Specifications
Base code30: Positions Per Row; 03.5: Lead Style; L: Plating Option (10 µ" (0.25 µm) Gold on contact area, Matte Tin on solder tail); 08: Number of Rows; 2: Solder Type (Lead-Free Solder Charge).
Finish / variantA: Alignment Pin; K: Polyimide Film Pick & Place Pad; TR: Tape & Reel packaging.
Connector TypeHigh Density Array, Male
Number of Positions240
Pitch0.050" (1.27mm)
Number of Rows8
Mounting TypeSurface Mount
FeaturesBoard Guide, Pick and Place
Contact FinishGold
Contact Finish Thickness10.0µin (0.25µm)
Mated Stacking Heights8.5mm, 9.5mm, 10mm, 11mm
Height Above Board0.240" (6.10mm)
Acceptable alternates
SEAM-30-03.5-P-08-2-A-K-TRDifferent plating option (SureCoat™ Palladium Nickel) explicitly documented for the series.
SEAM-30-03.5-L-08-1-A-K-TRDifferent solder type (Tin/Lead Alloy Solder Charge) explicitly documented for the series.
SEAM-30-03.5-L-08-2-A-K-FRDifferent packaging option (Full Reel Tape & Reel) explicitly documented for the series.
SEAM-30-03.5-L-08-2-A-TRWithout Polyimide Film Pick & Place Pad, explicitly documented as an option (Polyimide Pick & Place Pad standard without specifying –K).
Confirm acceptability against your drawing before ordering.